Electronic cards and equipment

Macrographic and micrographic examination of welds

Measurement of the thicknesses and the intermetallic layer

Evaluation of residual porosity

Testing of ion contamination (conductometric method and ion chromatography)

Chemical analysis with EDS microprobe of the solder and components

Analysis of welding residues and residues, examination of corrosion phenomena

Analysis of the cross section of electronic components (resistors, capacitors, diodes, ...) to search for internal defects or breaks after assembly on the PCB

RoHS compatibility