- Macrographic and micrographic examination of welds.
- Measurement of the thicknesses and the intermetallic layer
- Evaluation of residual porosity
- Testing of ion contamination (conductometric method and ion chromatography)
- Chemical analysis with EDS microprobe of the solder and components
- Analysis of welding residues and residues, examination of corrosion phenomena
- Analysis of the cross section of electronic components (resistors, capacitors, diodes, ...) to search for internal defects or breaks after assembly on the PCB
- RoHS compatibility
- Analysis of circuits and electronic boards according to IPC A610 standard
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