Electronic cards and equipment

  • Macrographic and micrographic examination of welds.
  • Measurement of the thicknesses and the intermetallic layer
  • Evaluation of residual porosity
  • Testing of ion contamination (conductometric method and ion chromatography)
  • Chemical analysis with EDS microprobe of the solder and components
  • Analysis of welding residues and residues, examination of corrosion phenomena
  • Analysis of the cross section of electronic components (resistors, capacitors, diodes, ...) to search for internal defects or breaks after assembly on the PCB
  • RoHS compatibility
  • Analysis of circuits and electronic boards according to IPC A610 standard


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