Macrographic and micrographic examination of welds.
Measurement of the thicknesses and the intermetallic layer
Evaluation of residual porosity
Testing of ion contamination (conductometric method and ion chromatography)
Chemical analysis with EDS microprobe of the solder and components
Analysis of welding residues and residues, examination of corrosion phenomena
Analysis of the cross section of electronic components (resistors, capacitors, diodes, ...) to search for internal defects or breaks after assembly on the PCB
RoHS compatibility
Analysis of circuits and electronic boards according to IPC A610 standard
